Lead-Free Solder Alloy

Lead-Free Solder Alloy
Features:
- Lowest Melting Point (217°C -218°C)     - Excellent Fatigue Resistance
- Compatible with all Flux Types      - Excellent Solder Joint Reliability
Description:
SAC305 is a lead-free alloy that contains 96.5 % tin, 3% silver, and 0.5% copper. This alloy falls under
the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar
solder offers far superior fluidity as compared to other alloys and makes of bar, resulting in excellent
flow. AIM’s SAC305 bar solder also produces less dross than other bar solder, wets well, provides
superior joint strength, and offers superior copper dissolution rates. AIM’s SAC305 bar solder is alloyed
in the proprietary Electropure™  method that results in a low drossing, high wetting solder. The
Electropure™ process reduces suspended oxides in the solder, thus reducing drossing, improving flow and
reducing bridging during soldering. SAC305 may be used with most existing equipment, processes,
coatings, and flux chemistries.
Temperature Requirements:
Wave soldering pot temperature of 265° -270°C (509° -518°F).
Refer to the flux data sheet for specific pre-heat instructions.
Physical Properties:
Specific Gravity: Approx. 7.38
Melting Temperature: 217° -218°C (423° -424°F)
Alloy Composition:
Typical Impurity Levels:
Packaging:
-  SAC305 is  available  in 1.1 kg (2.5 lb) triangular bars to easily distinguish it  from traditional
rectangular tin-lead bars.
-  SAC305 is available in solid feeder wire diameters of 3.175 mm (.125”). Other sizes are available
upon special request.
-  SAC305 is also available in Glow Core, OAJ, WS482, RA and RMA cored wire on ½ lb. spools for
.010 and .015 diameters, and 1lb. spools for .020, .032, .040, .050 and .062 diameters. Other diameters
and spool sizes are available upon special request.
Sn: Balance  Ag: 3.0 ± 0.2  Cu: 0.5 ± 0.1
Al: < 0.001  Sb: 0.02  Cd: < 0.001  Fe: <0.01  In: <0.01
As: < 0.01  Bi: 0.01  Zn: < 0.001  Ni: < 0.002  Pb: 0.02
SAC305
Flux Compatibility:
SAC305 bar solder is compatible with all major no-clean and water soluble electronic grade fluxes on the
market today.
Cleaning:
Refer to data sheets provided by the flux manufacturer.
Handling and Storage:
-   If this alloy is used in water soluble cored wire, the product will have a shelf life of 3 years. All other
cored wire, solid wire, and bar solder products have an indefinite shelf life.
-   Consult the MSDS for specific handling procedures.
Safety:
-  Use with adequate ventilation and proper personal protective equipment.
-  Refer to the accompanying MSDS for any specific emergency information.
-  Do not dispose of any hazardous materials in non-approved containers.
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AIM IS ISO9001:2008 & ISO14001:2004 CERTIFIED
The information contained herein is based on data considered accurate and is offered at no charge. Product information is based upon the
assumption of proper handling and operating conditions. All information pertaining to solder paste is produced with 45-micron powder.
Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. Please
refer to http://www.aimsolder.com/Home/TermsConditions.aspx  to review AIM's terms and conditions.
08/14
Document Rev # 7